这个行业通常查什么
- 外观缺陷
- 二维尺寸
- 镀层厚度
- 焊点金相
- 高低温可靠性
客户最常问的一个问题
微米级焊点截面怎么制样才能不产生倒角与拖尾?
把试样尺寸、材料牌号与执行标准发给我们,工程师会给出判定方法与设备配置,可先寄样试测。
提交这个问题 →Electronics & semiconductor
Packaging, PCB and precision structures need non-contact, high-magnification, automated judgment.
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以上机型按行业常用配置排序;试样尺寸特殊或需要非标工装时,可按下单要求定制。
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